Analysts said U.S. Commerce Secretary Howard Lutnick’s call for a Taiwan–U.S. “50-50” semiconductor production split was more likely aimed at pressuring Taiwan to expand investment in the United States and help build a complete supply chain.

Earlier this year, Taiwan Semiconductor Manufacturing Co. (TSMC) pledged an additional US$100 billion in Arizona, raising its total U.S. commitment to US$165 billion. Once complete, about 30 percent of its sub-2nm capacity would be located at its U.S. plants. Lutnick floated the “50-50” concept during media interviews amid ongoing Taiwan–U.S. tariff talks, saying he hoped to lift America’s chip self-sufficiency to 40 percent by the time he leaves office — a goal requiring more than US$500 billion in investment.

Nobunaga Chai (柴煥欣), vice president of CloudExpress Edge Lab, an independent platform on policy and industry, said Lutnick did not clarify whether the split referred only to advanced nodes or included mature processes, or whether it was measured by chip volume or production value. TSMC’s sub-5nm capacity totals 450,000 wafers per month, while its six Arizona fabs, once complete, would produce 190,000 to 200,000 wafers monthly. Factoring in other advanced fabs in the U.S., he said, the 50 percent target could be achievable.

“If you add Intel’s Oregon fab under construction and Samsung’s Texas fab — both producing at the 1.8nm and 2nm nodes — then combining Samsung’s and Intel’s capacity together, the U.S. could actually reach the so-called 50 percent share of global advanced-node production. It wouldn’t be that difficult,” Chai said.

Chai added the U.S. strategy effectively asks Taiwan to share the financial burden of expanding America’s chip base. He urged Taipei to keep room for negotiation, citing South Korean President Lee Jae-myung’s pushback against similar U.S. demands.