Tesla is recruiting engineers in Taiwan for a planned artificial intelligence chip manufacturing facility known as “Terafab,” according to job postings on the company’s website. The postings list nine full-time engineering roles tied to the project, seeking candidates with at least five years of experience in advanced semiconductor manufacturing processes.

The company describes Terafab as a “vertically integrated semiconductor factory” that would handle logic, memory, packaging, testing, and photomask production. Chief Executive Officer Elon Musk announced the Terafab initiative last month, outlining plans to build a large-scale AI chip plant for use in robotics and data center computing.

Several of the Taiwan-based roles require experience with manufacturing nodes below 7 nanometers, including familiarity with emerging 2-nanometer technologies. One position also calls for knowledge of advanced packaging technologies such as CoWoS and SoIC, developed by TSMC. The roles span key front-end manufacturing processes, including lithography, etching, thin-film deposition, and chemical mechanical planarization, as well as yield engineering and process integration.

According to the postings, the facility is expected to support multiple chip lines, including edge inference processors, radiation-hardened chips for satellites, and high-bandwidth memory.

Responding to media questions regarding Tesla’s Terafab plan this Thursday, TSMC Chairperson C.C. Wei (魏哲家) said he will not underestimate competitors, but emphasized that building a new wafer fab takes two to three years. He said mass production takes another one to two years, and that there are no shortcuts in the wafer foundry.