Taiwan Semiconductor Manufacturing Company (TSMC) unveiled its latest chip manufacturing A13 process during its North America Technology Symposium in California on Wednesday, April 22, local time. The new node represents an advancement in terms of density and power efficiency and is aimed at the AI and high-performance computing market segments.

TSMC says that the process will enter mass production in 2029. Compared to the company’s previous A14 node, the A13 features a 6% reduction in die area but maintains full compatibility with its predecessor, allowing customers to quickly upgrade.

During the symposium, TSMC also previewed its next-generation A12 process, featuring the Super Power Rail technology. Its production is also expected to begin in 2029.