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Taiwan envoy urges deeper Malaysia chip ties to boost Asia supply chain resilience

07/05/2026 16:29
Editor: Eloise Phillips
Ambassador Lien Yu-ping, Representative of the Taipei Economic and Cultural Office in Malaysia. (Photo provided by the TECO in Malaysia)
Ambassador Lien Yu-ping, Representative of the Taipei Economic and Cultural Office in Malaysia. (Photo provided by the TECO in Malaysia)

Taiwan and Malaysia have strong potential to deepen semiconductor cooperation, a move that could bolster the resilience of Asia's supply chain, Taiwan's Representative to Malaysia Lien Yu-ping said Wednesday. 

Speaking at the Taiwan Go Global - Taiwan & SEA Semiconductor Networking Reception, Lien said Taiwan holds a global competitive edge in chip design, manufacturing and advanced processes, while Malaysia plays a key role in backend packaging, testing and electronics manufacturing services. The two sides are “highly complementary” in the semiconductor supply chain industry, she said.

 
Lien noted that closer integration of their respective strengths would not only enhance regional supply chain resilience but also create new opportunities for future high-tech industries. She said semiconductors are central to global technological and economic development, underpinning applications from AI and high-performance computing to 5G, electric vehicles, robotics and smart manufacturing. 

During a late-April visit to Penang, Lien met Taiwanese firms, including ASE and TECOBAR, observing continued investment in automated packaging, testing facilities, and smart energy solutions. 

She also urged Malaysia to begin talks with Taiwan to update the Taiwan-Malaysia Bilateral Investment Agreement (BIA), in force for more than 30 years, to improve investment protections and attract more Taiwanese businesses.

Lien joined Global Chief Marketing Officer and President of Taiwan at SEMI Terry Tsao, SEMI Southeast Asia President Linda Tan, and other industry representatives to discuss cooperation prospects. 

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