American Institute in Taiwan (AIT) Director Raymond Greene called TSMC’s additional US$100 billion investment in its Arizona plant the best demonstration of trust between the United States and Taiwan. On Thursday, July 16, TSMC announced the investment will help pay for four new 2nm chip fabs and advanced packaging facilities to better meet the needs of its U.S. customers. 

Director Greene’s social media post noted that the move is good for workers, consumers, and industries in both countries, and benefits the world by bolstering resilient supply chains. 

The AIT congratulated the company on Facebook, citing multiple U.S. government sources that noted this will bring TSMC’s total investment to US$265 billion, and a total of 12 U.S. semiconductor and packaging plants. 

Greene said this investment will ensure that TSMC stands shoulder-to-shoulder with its U.S. customers, allowing for a quicker response to the increasing market demand for semiconductors. This move, he said, supports U.S. and Taiwanese economic prosperity and bolsters resilient global supply chains.

Greene pointed out that the global market is expanding too rapidly to be addressed by a single ecosystem. Taiwan’s semiconductor industry output reflects this trend, vaulting from NT$4.3 trillion (over US$132 billion) in 2023 to a projected NT$8.4 trillion (over US$259 billion) in 2026.

He called the announcement a perfect illustration of the mutually beneficial U.S.-Taiwan economic partnership. He said the deal benefits both sides on multiple levels, and the partnership overall, saying that he said “cement[s] a partnership built for the next generation of technology.”