Vice Premier Cheng Li-chiun (center) recently traveled to the U.S. again to negotiate reciprocal tariffs. She returned to Taiwan on a flight early on Wednesday and gave a joint media interview at Taoyuan International Airport, stating that the negotiating team never made a 50/50 promise for chips. (Photo: CNA)
Taiwan’s Cabinet said Wednesday that the idea of a Taiwan–U.S. “50-50” semiconductor production split was a unilateral proposal from Washington and that Taiwan has made no commitments.